Thermal stability of the microstructure of silver films
- Authors: Sursaeva V.G.1, Straumal A.B.1
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Affiliations:
- Institute of Solid State Physics
- Issue: Vol 2017, No 4 (2017)
- Pages: 263-266
- Section: Advanced Materials and Technologies
- URL: https://journals.rcsi.science/0036-0295/article/view/171397
- DOI: https://doi.org/10.1134/S003602951704022X
- ID: 171397
Cite item
Abstract
The thermal stability of freely suspended silver films 100 nm thick is studied during isothermal annealing at temperatures of 350–600°C for different times. At temperatures of 350–450°C, only grain growth is observed. Above 450°C, along with grain growth, the formation and growth of hillocks and holes take place; in this case, grain boundaries are essential in the processes. A continuous film transforms into a cellular one. At 500°C, the growth processes of both grains and holes have the same incubation period, during which no grain growth, hole formation, and hole growth take place.
About the authors
V. G. Sursaeva
Institute of Solid State Physics
Author for correspondence.
Email: sursaeva@issp.ac.ru
Russian Federation, Chernogolovka, 142432
A. B. Straumal
Institute of Solid State Physics
Email: sursaeva@issp.ac.ru
Russian Federation, Chernogolovka, 142432