Email this article Method of reducing the gap between chips in mosaic photodetector modules
- Authors: Novoselov A.R.1
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Affiliations:
- Design and Technological Institute of Applied Microelectronics, Novosibirsk Department of Rzhanov Institute of Semiconductor Physics, Siberian Branch
- Issue: Vol 52, No 1 (2016)
- Pages: 96-100
- Section: Physical and Engineering Fundamentals of Microelectronics and Optoelectronics
- URL: https://journals.rcsi.science/8756-6990/article/view/211922
- DOI: https://doi.org/10.3103/S8756699016010143
- ID: 211922
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Abstract
A method is proposed to shape the edges of chips in order to reduce the gap between chips in infrared-sensitive mosaic photodetectors modules. The method involves laser scribing of asymmetric grooves, splitting-off of the edge of the chip surface going under the chip, and the subsequent vertical alignment of the edges using laser radiation. The width of the gap between chips is 1–3 μm.
About the authors
A. R. Novoselov
Design and Technological Institute of Applied Microelectronics, Novosibirsk Department of Rzhanov Institute of Semiconductor Physics, Siberian Branch
Author for correspondence.
Email: novoselov@oesd.ru
Russian Federation, ul. Nikolaeva 8, Novosibirsk, 630090
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