Residual stresses in nanocomposites in curing epoxy oligomers
- Autores: Simonov-Emel’yanov I.D.1, Pykhtin A.A.1, Kovaleva A.N.1
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Afiliações:
- Moscow Technological University
- Edição: Volume 11, Nº 11-12 (2016)
- Páginas: 801-804
- Seção: Article
- URL: https://journals.rcsi.science/2635-1676/article/view/219765
- DOI: https://doi.org/10.1134/S1995078016060173
- ID: 219765
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Resumo
The impact of nanofiller particles of a silicon nature on the kinetics and accretion rate of shrinkage residual stresses upon curing bisphenol epoxy oligomers (BEOs) DER-330 and ED-20 has been considered. The influence of the nature and molecular weight of the oligomer, the concentration of nanoparticles (and their agglomeration), and the temperature level of residual curing stresses has been determined. The influence of nanoscale particles on the kinetics of accretion of residual stress, induction period, rate, and their level when curing epoxy oligomers has been determined for the first time.
Sobre autores
I. Simonov-Emel’yanov
Moscow Technological University
Email: nanocntpolimer@gmai.com
Rússia, Moscow, 119571
A. Pykhtin
Moscow Technological University
Autor responsável pela correspondência
Email: nanocntpolimer@gmai.com
Rússia, Moscow, 119571
A. Kovaleva
Moscow Technological University
Email: nanocntpolimer@gmai.com
Rússia, Moscow, 119571
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