Residual stresses in nanocomposites in curing epoxy oligomers


Citar

Texto integral

Acesso aberto Acesso aberto
Acesso é fechado Acesso está concedido
Acesso é fechado Somente assinantes

Resumo

The impact of nanofiller particles of a silicon nature on the kinetics and accretion rate of shrinkage residual stresses upon curing bisphenol epoxy oligomers (BEOs) DER-330 and ED-20 has been considered. The influence of the nature and molecular weight of the oligomer, the concentration of nanoparticles (and their agglomeration), and the temperature level of residual curing stresses has been determined. The influence of nanoscale particles on the kinetics of accretion of residual stress, induction period, rate, and their level when curing epoxy oligomers has been determined for the first time.

Sobre autores

I. Simonov-Emel’yanov

Moscow Technological University

Email: nanocntpolimer@gmai.com
Rússia, Moscow, 119571

A. Pykhtin

Moscow Technological University

Autor responsável pela correspondência
Email: nanocntpolimer@gmai.com
Rússia, Moscow, 119571

A. Kovaleva

Moscow Technological University

Email: nanocntpolimer@gmai.com
Rússia, Moscow, 119571

Arquivos suplementares

Arquivos suplementares
Ação
1. JATS XML

Declaração de direitos autorais © Pleiades Publishing, Ltd., 2016