Residual stresses in nanocomposites in curing epoxy oligomers
- Авторлар: Simonov-Emel’yanov I.D.1, Pykhtin A.A.1, Kovaleva A.N.1
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Мекемелер:
- Moscow Technological University
- Шығарылым: Том 11, № 11-12 (2016)
- Беттер: 801-804
- Бөлім: Article
- URL: https://journals.rcsi.science/2635-1676/article/view/219765
- DOI: https://doi.org/10.1134/S1995078016060173
- ID: 219765
Дәйексөз келтіру
Аннотация
The impact of nanofiller particles of a silicon nature on the kinetics and accretion rate of shrinkage residual stresses upon curing bisphenol epoxy oligomers (BEOs) DER-330 and ED-20 has been considered. The influence of the nature and molecular weight of the oligomer, the concentration of nanoparticles (and their agglomeration), and the temperature level of residual curing stresses has been determined. The influence of nanoscale particles on the kinetics of accretion of residual stress, induction period, rate, and their level when curing epoxy oligomers has been determined for the first time.
Авторлар туралы
I. Simonov-Emel’yanov
Moscow Technological University
Email: nanocntpolimer@gmai.com
Ресей, Moscow, 119571
A. Pykhtin
Moscow Technological University
Хат алмасуға жауапты Автор.
Email: nanocntpolimer@gmai.com
Ресей, Moscow, 119571
A. Kovaleva
Moscow Technological University
Email: nanocntpolimer@gmai.com
Ресей, Moscow, 119571
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