Residual stresses in nanocomposites in curing epoxy oligomers
- Авторы: Simonov-Emel’yanov I.D.1, Pykhtin A.A.1, Kovaleva A.N.1
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Учреждения:
- Moscow Technological University
- Выпуск: Том 11, № 11-12 (2016)
- Страницы: 801-804
- Раздел: Article
- URL: https://journals.rcsi.science/2635-1676/article/view/219765
- DOI: https://doi.org/10.1134/S1995078016060173
- ID: 219765
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Аннотация
The impact of nanofiller particles of a silicon nature on the kinetics and accretion rate of shrinkage residual stresses upon curing bisphenol epoxy oligomers (BEOs) DER-330 and ED-20 has been considered. The influence of the nature and molecular weight of the oligomer, the concentration of nanoparticles (and their agglomeration), and the temperature level of residual curing stresses has been determined. The influence of nanoscale particles on the kinetics of accretion of residual stress, induction period, rate, and their level when curing epoxy oligomers has been determined for the first time.
Об авторах
I. Simonov-Emel’yanov
Moscow Technological University
Email: nanocntpolimer@gmai.com
Россия, Moscow, 119571
A. Pykhtin
Moscow Technological University
Автор, ответственный за переписку.
Email: nanocntpolimer@gmai.com
Россия, Moscow, 119571
A. Kovaleva
Moscow Technological University
Email: nanocntpolimer@gmai.com
Россия, Moscow, 119571
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