TECHNOLOGICAL RUNNING-IN TIME REDUCE FOR FRICTION SURFACES

The process control analysis for the period of running-in of friction pair parts is carried out. Technological and other ways for running-in time reduce are given. The mode and equipment of low-temperature annealing in silicon dioxide are presented. Roughness measurement instrument, chemical composition measurement, structure and wear measurement of the surface are provided. It is found that under low-temperature annealing in silicon dioxide, the surface roughness is smoothed according to the main roughness parameters. The height roughness parameters Ra, Rmax decreased: Ra (parameter) by 4,5 times; the Rmax (parameter) by 5,1 times. The stepwise parameters S, Sm had differently directed movement: the parameter Sm increased by 2.2 times; the parameter S decreased by 1,6 times. A decrease in the height Ra, Rmax and an increase in the stepwise Sm roughness parameters proves surface smoothing resulted from annealing. A decrease in the parameter S indicates a general decrease in the number of roughness peaks. It should also be noted that the value of the parameter of the tp profile reference curve decreases by 50 %, as a characteristic of reducing the bearing capacity of the material. The results of the chemical analysis showed an increase in the amount of silicon in the surface layer and a decrease in the amount of chromium. Metallographic analysis made it possible to come at the formation of a surface layer enriched with silicon. As a result of wear tests, it was found that the total wear of a sample friction pair after low-temperature annealing decreased as compared to the base sample. Under wear tests, the cylinder-plane scheme was used at the load of 30 N.

running-in, low-temperature annealing, silicon dioxide, wear, surface quality