Physical Characteristics of Friction Processes in a Columnar Approach-Separation Model with Tangential Force

Abstract

Three-dimensional molecular dynamics (MD) simulation is conducted to understanding the dynamics processes of atomic-scale friction, which takes place in the columnar approach-separation model. A cylinder-cylinder sliding simulation model with tangential stress for Cu/Cu is built. Embedded atom potential (EAM) is employed for simulation. Based on the simulation result and the adhesion theory, the temperature change, friction force evolution and microstructures are systematically analyzed. The simulation results show that the temperature is related to the friction force, both increased during the transient sliding period. The friction force curve is analyzed by real contact area with tangential stress. Fluid mechanics is implanted to explain the decrease of friction force. An epitaxial bcc (body center cubic) copper layer is formed inducing adhesion during sliding. The rough peaks break causing the atoms leaving from interface.