Heat-Resistant Polyfunctional Materials for Microelectronics: Hydrodynamic, Optical, and Conformational Properties of Si-Containing Poly(ortho-Hydroxy Amide)

Abstract

Polycondensation of a mixture of diamines, 3,3'-dihydroxy-4,4'-diaminodiphenylmethane and bis-(3-aminopropyl)dimethylsiloxane taken in a 3: 2 molar ratio, with isophthaloyl chloride was used to synthesize a silicon-containing poly(ortho-hydroxyamide) POA-Si exhibiting an increased adhesion to such substrates as Si, SiO₂, quartz, glass, and glass-ceramics. The polymer was separated by the fractional precipitation method into seven fractions and its polydispersity was evaluated. The degree of intramolecular orientation ordering (Kuhn segment) was determined and Mark–Kuhn–Houwink equations were derived, which can be used to determine the molecular masses of the newly synthesized samples.