Heat-Resistant Polyfunctional Materials for Microelectronics: Hydrodynamic, Optical, and Conformational Properties of Si-Containing Poly(ortho-Hydroxy Amide)


如何引用文章

全文:

开放存取 开放存取
受限制的访问 ##reader.subscriptionAccessGranted##
受限制的访问 订阅存取

详细

Polycondensation of a mixture of diamines, 3,3'-dihydroxy-4,4'-diaminodiphenylmethane and bis-(3-aminopropyl)dimethylsiloxane taken in a 3: 2 molar ratio, with isophthaloyl chloride was used to synthesize a silicon-containing poly(ortho-hydroxyamide) POA-Si exhibiting an increased adhesion to such substrates as Si, SiO2, quartz, glass, and glass-ceramics. The polymer was separated by the fractional precipitation method into seven fractions and its polydispersity was evaluated. The degree of intramolecular orientation ordering (Kuhn segment) was determined and Mark–Kuhn–Houwink equations were derived, which can be used to determine the molecular masses of the newly synthesized samples.

作者简介

L. Rudaya

St. Petersburg State Technological Institute (Technical University)

编辑信件的主要联系方式.
Email: 9241890@mail.ru
俄罗斯联邦, Moskovskii pr. 26, St. Petersburg, 190013

I. Strelina

Institute of Macromolecular Compounds

Email: 9241890@mail.ru
俄罗斯联邦, Bolshoi pr. 31, St. Petersburg, 199004

O. Okatova

Institute of Macromolecular Compounds

Email: 9241890@mail.ru
俄罗斯联邦, Bolshoi pr. 31, St. Petersburg, 199004

M. Bezrukova

Institute of Macromolecular Compounds

Email: 9241890@mail.ru
俄罗斯联邦, Bolshoi pr. 31, St. Petersburg, 199004

M. Bol’shakov

Institute of Macromolecular Compounds

Email: 9241890@mail.ru
俄罗斯联邦, Bolshoi pr. 31, St. Petersburg, 199004

A. Marfichev

Institute of Macromolecular Compounds

Email: 9241890@mail.ru
俄罗斯联邦, Bolshoi pr. 31, St. Petersburg, 199004

G. Lebedeva

Institute of Macromolecular Compounds

Email: 9241890@mail.ru
俄罗斯联邦, Bolshoi pr. 31, St. Petersburg, 199004

S. Ramsh

St. Petersburg State Technological Institute (Technical University)

Email: 9241890@mail.ru
俄罗斯联邦, Moskovskii pr. 26, St. Petersburg, 190013

补充文件

附件文件
动作
1. JATS XML

版权所有 © Pleiades Publishing, Ltd., 2017