Target cleaning for faster CrN/AlN coating growth in magnetron sputtering

I. M. Bukarev; A. V. Sobol’kov; A. V. Aborkin

doi:10.3103/S1068798X17060090

Target cleaning for faster CrN/AlN coating growth in magnetron sputtering

作者: Bukarev I.M.¹, Sobol’kov A.V.¹, Aborkin A.V.¹
隶属关系:
1. Stoletov Vladimir State University
期: 卷 37, 编号 6 (2017)
页面: 502-504
栏目: Article
URL: https://journals.rcsi.science/1068-798X/article/view/227318
DOI: https://doi.org/10.3103/S1068798X17060090
ID: 227318

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详细

Metallic sputtering may be used to clean the target surface in the course of coating application by reactive magnetron sputtering. The introduction of additional stages of metallic sputtering in reactive magnetron sputtering increases the growth rate of CrN/AlN coatings by around 23%, with little change in physicomechanical properties.