Target cleaning for faster CrN/AlN coating growth in magnetron sputtering

Аннотация

Metallic sputtering may be used to clean the target surface in the course of coating application by reactive magnetron sputtering. The introduction of additional stages of metallic sputtering in reactive magnetron sputtering increases the growth rate of CrN/AlN coatings by around 23%, with little change in physicomechanical properties.