Effect of a diamond heat spreader on the characteristics of gallium nitride-based transistors


如何引用文章

全文:

开放存取 开放存取
受限制的访问 ##reader.subscriptionAccessGranted##
受限制的访问 订阅存取

详细

A problem, which concerns the effect of the diamond heat-spreading layer on the temperature and voltage-current characteristics of gallium nitride (GaN) high-electron-mobility transistors (HEMTs) is solved for the first time in a hydrodynamic model (which includes the continuity equation, Poisson equation, and equations for electron and lattice temperatures). The mechanism of the occurrence of peak electron and lattice temperatures (hot spots) is analyzed. It is shown that introducing a heat spreader considerably reduces the maximum temperature (by 263 K for a sapphire substrate and by 163 K for a silicon carbide substrate) and improves the voltage-current characteristics. The effectiveness of the heat spreader is evaluated depending on its thickness, gate size, and substrate material to find the optimum design.

作者简介

K. Grishakov

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

编辑信件的主要联系方式.
Email: ksgrishakov@yahoo.com
俄罗斯联邦, Moscow

V. Elesin

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

Email: ksgrishakov@yahoo.com
俄罗斯联邦, Moscow

N. Kargin

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

Email: ksgrishakov@yahoo.com
俄罗斯联邦, Moscow

R. Ryzhuk

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

Email: ksgrishakov@yahoo.com
俄罗斯联邦, Moscow

S. Minnebaev

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

Email: ksgrishakov@yahoo.com
俄罗斯联邦, Moscow

补充文件

附件文件
动作
1. JATS XML

版权所有 © Pleiades Publishing, Ltd., 2016