Analyzing flaws in electric components by scanning acoustic microscopy
- Авторлар: Burov R.B.1, Stoyanov A.A.2, Vinokurov A.A.2, Zenin V.V.2
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Мекемелер:
- Scientific Research Institute of Electric Equipment
- Voronezh State Technical University
- Шығарылым: Том 53, № 9 (2017)
- Беттер: 615-619
- Бөлім: Acoustic Methods
- URL: https://journals.rcsi.science/1061-8309/article/view/181417
- DOI: https://doi.org/10.1134/S1061830917090042
- ID: 181417
Дәйексөз келтіру
Аннотация
Flaws that occur due to the following processes involved in the production of electronic components have been examined: soldering of crystals to pack bases; assembly of flip-chips; and sealing of integrated circuits with a plastic. The analysis has been performed by scanning acoustic microscopy.
Негізгі сөздер
Авторлар туралы
R. Burov
Scientific Research Institute of Electric Equipment
Хат алмасуға жауапты Автор.
Email: romansansay@ya.ru
Ресей, Voronezh, 394033
A. Stoyanov
Voronezh State Technical University
Email: romansansay@ya.ru
Ресей, Voronezh, 394026
A. Vinokurov
Voronezh State Technical University
Email: romansansay@ya.ru
Ресей, Voronezh, 394026
V. Zenin
Voronezh State Technical University
Email: romansansay@ya.ru
Ресей, Voronezh, 394026
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