Analyzing flaws in electric components by scanning acoustic microscopy

R. B. Burov; A. A. Stoyanov; A. A. Vinokurov; V. V. Zenin

doi:10.1134/S1061830917090042

Analyzing flaws in electric components by scanning acoustic microscopy

Autores: Burov R.B.¹, Stoyanov A.A.², Vinokurov A.A.², Zenin V.V.²
Afiliações:
1. Scientific Research Institute of Electric Equipment
2. Voronezh State Technical University
Edição: Volume 53, Nº 9 (2017)
Páginas: 615-619
Seção: Acoustic Methods
URL: https://journals.rcsi.science/1061-8309/article/view/181417
DOI: https://doi.org/10.1134/S1061830917090042
ID: 181417

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Resumo

Flaws that occur due to the following processes involved in the production of electronic components have been examined: soldering of crystals to pack bases; assembly of flip-chips; and sealing of integrated circuits with a plastic. The analysis has been performed by scanning acoustic microscopy.