Ultrasonic infrared thermography in non-destructive testing: A review


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Abstract

Potentials of a novel non-destructive testing technique called ultrasonic infrared thermography (UIT) have been widely recognized for the last decade. This technique is promising for many practical industrial applications being of interest for academic researchers who deal with thermomechanical problems. Significant improvements in the performance of infrared imager have also contributed to increasing popularity of this inspection technique. This paper presents an introduction to the use of UIT in NDT, combining a review of earlier and later research with some experimental illustrations.

About the authors

M. Z. Umar

National University of Malaysia

Email: vavilov@tpu.ru
Malaysia, Bangi, Selangor, 43600

V. Vavilov

National Research Tomsk Polytechnic University

Author for correspondence.
Email: vavilov@tpu.ru
Russian Federation, 7, Savinykh St., Tomsk, 634028

H. Abdullah

National University of Malaysia

Email: vavilov@tpu.ru
Malaysia, Bangi, Selangor, 43600

A. K. Ariffin

National University of Malaysia

Email: vavilov@tpu.ru
Malaysia, Bangi, Selangor, 43600


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