Ultrasonic infrared thermography in non-destructive testing: A review
- Authors: Umar M.Z.1, Vavilov V.2, Abdullah H.1, Ariffin A.K.1
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Affiliations:
- National University of Malaysia
- National Research Tomsk Polytechnic University
- Issue: Vol 52, No 4 (2016)
- Pages: 212-219
- Section: Thermal Methods
- URL: https://journals.rcsi.science/1061-8309/article/view/181125
- DOI: https://doi.org/10.1134/S1061830916040082
- ID: 181125
Cite item
Abstract
Potentials of a novel non-destructive testing technique called ultrasonic infrared thermography (UIT) have been widely recognized for the last decade. This technique is promising for many practical industrial applications being of interest for academic researchers who deal with thermomechanical problems. Significant improvements in the performance of infrared imager have also contributed to increasing popularity of this inspection technique. This paper presents an introduction to the use of UIT in NDT, combining a review of earlier and later research with some experimental illustrations.
About the authors
M. Z. Umar
National University of Malaysia
Email: vavilov@tpu.ru
Malaysia, Bangi, Selangor, 43600
V. Vavilov
National Research Tomsk Polytechnic University
Author for correspondence.
Email: vavilov@tpu.ru
Russian Federation, 7, Savinykh St., Tomsk, 634028
H. Abdullah
National University of Malaysia
Email: vavilov@tpu.ru
Malaysia, Bangi, Selangor, 43600
A. K. Ariffin
National University of Malaysia
Email: vavilov@tpu.ru
Malaysia, Bangi, Selangor, 43600