Ultrasonic infrared thermography in non-destructive testing: A review


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详细

Potentials of a novel non-destructive testing technique called ultrasonic infrared thermography (UIT) have been widely recognized for the last decade. This technique is promising for many practical industrial applications being of interest for academic researchers who deal with thermomechanical problems. Significant improvements in the performance of infrared imager have also contributed to increasing popularity of this inspection technique. This paper presents an introduction to the use of UIT in NDT, combining a review of earlier and later research with some experimental illustrations.

作者简介

M. Umar

National University of Malaysia

Email: vavilov@tpu.ru
马来西亚, Bangi, Selangor, 43600

V. Vavilov

National Research Tomsk Polytechnic University

编辑信件的主要联系方式.
Email: vavilov@tpu.ru
俄罗斯联邦, 7, Savinykh St., Tomsk, 634028

H. Abdullah

National University of Malaysia

Email: vavilov@tpu.ru
马来西亚, Bangi, Selangor, 43600

A. Ariffin

National University of Malaysia

Email: vavilov@tpu.ru
马来西亚, Bangi, Selangor, 43600

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