Ultrasonic infrared thermography in non-destructive testing: A review
- 作者: Umar M.Z.1, Vavilov V.2, Abdullah H.1, Ariffin A.K.1
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隶属关系:
- National University of Malaysia
- National Research Tomsk Polytechnic University
- 期: 卷 52, 编号 4 (2016)
- 页面: 212-219
- 栏目: Thermal Methods
- URL: https://journals.rcsi.science/1061-8309/article/view/181125
- DOI: https://doi.org/10.1134/S1061830916040082
- ID: 181125
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详细
Potentials of a novel non-destructive testing technique called ultrasonic infrared thermography (UIT) have been widely recognized for the last decade. This technique is promising for many practical industrial applications being of interest for academic researchers who deal with thermomechanical problems. Significant improvements in the performance of infrared imager have also contributed to increasing popularity of this inspection technique. This paper presents an introduction to the use of UIT in NDT, combining a review of earlier and later research with some experimental illustrations.
作者简介
M. Umar
National University of Malaysia
Email: vavilov@tpu.ru
马来西亚, Bangi, Selangor, 43600
V. Vavilov
National Research Tomsk Polytechnic University
编辑信件的主要联系方式.
Email: vavilov@tpu.ru
俄罗斯联邦, 7, Savinykh St., Tomsk, 634028
H. Abdullah
National University of Malaysia
Email: vavilov@tpu.ru
马来西亚, Bangi, Selangor, 43600
A. Ariffin
National University of Malaysia
Email: vavilov@tpu.ru
马来西亚, Bangi, Selangor, 43600
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