Analysis of Plane Cylindrical Wafer Defects by the Spectral-Domain Integral Equation Method
- Авторлар: Lopushenko V.V.1
-
Мекемелер:
- Faculty of Computational Mathematics and Cybernetics, Moscow State University
- Шығарылым: Том 27, № 1 (2016)
- Беттер: 44-59
- Бөлім: Article
- URL: https://journals.rcsi.science/1046-283X/article/view/247479
- DOI: https://doi.org/10.1007/s10598-015-9303-0
- ID: 247479
Дәйексөз келтіру
Аннотация
A computer algorithm using a volume integral equation in the spectral domain is developed for the analysis of the scattering properties of plane objects in the shape of elliptical cylinders on the surface of the wafer or near it. The capabilities of the proposed algorithm are demonstrated for the case of particles of different materials and different shapes.
Негізгі сөздер
Авторлар туралы
V. Lopushenko
Faculty of Computational Mathematics and Cybernetics, Moscow State University
Хат алмасуға жауапты Автор.
Email: lopushnk@cs.msu.ru
Ресей, Moscow
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