Email this article Analysis of Plane Cylindrical Wafer Defects by the Spectral-Domain Integral Equation Method
- Authors: Lopushenko V.V.1
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Affiliations:
- Faculty of Computational Mathematics and Cybernetics, Moscow State University
- Issue: Vol 27, No 1 (2016)
- Pages: 44-59
- Section: Article
- URL: https://journals.rcsi.science/1046-283X/article/view/247479
- DOI: https://doi.org/10.1007/s10598-015-9303-0
- ID: 247479
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Abstract
A computer algorithm using a volume integral equation in the spectral domain is developed for the analysis of the scattering properties of plane objects in the shape of elliptical cylinders on the surface of the wafer or near it. The capabilities of the proposed algorithm are demonstrated for the case of particles of different materials and different shapes.
About the authors
V. V. Lopushenko
Faculty of Computational Mathematics and Cybernetics, Moscow State University
Author for correspondence.
Email: lopushnk@cs.msu.ru
Russian Federation, Moscow
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