Investigation of an ion-implanted semiconductor layer by X-ray fluorescence analysis and ellipsometry

Abstract

A method for determining the depth distribution of ion-implanted impurity atoms in semiconductors is developed. The method consists in measuring the concentration of impurities by X-ray fluorescence analysis upon the ellipsometry controlled removal of thin semiconductor layers. It is found that the prolonged low-energy X-ray radiation exposure of an ion-implanted semiconductor layer leads to a change in the distribution profile of the ion-implanted impurity atoms.