Email this article Using Variations in the Frequency of a Ring Oscillator to Measure the Thermal Resistance of Digital Integrated Circuits
- Authors: Sergeev V.A.1,2, Teten’kin Y.G.1
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Affiliations:
- Ulyanovsk Branch, Kotelnikov Institute of Radio Engineering and Electronics, Russian Academy of Sciences
- Ulyanovsk State Technical University
- Issue: Vol 61, No 2 (2018)
- Pages: 154-160
- Section: Thermal Measurements
- URL: https://journals.rcsi.science/0543-1972/article/view/246404
- DOI: https://doi.org/10.1007/s11018-018-1402-9
- ID: 246404
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Abstract
We propose using logic-element time delay as a temperature-sensitive parameter to measure the thermal resistance of digital integrated circuits. We show that the frequency of a ring oscillator constructed using logic elements is inversely proportional to the signal delay time and is a linearly decreasing function of the temperature. We describe a technique for measuring the thermal resistance of a digital integrated circuit as it is heated by its own power consumption.
About the authors
V. A. Sergeev
Ulyanovsk Branch, Kotelnikov Institute of Radio Engineering and Electronics, Russian Academy of Sciences; Ulyanovsk State Technical University
Author for correspondence.
Email: sva@ulstu.ru
Russian Federation, Ulyanovsk; Ulyanovsk
Ya. G. Teten’kin
Ulyanovsk Branch, Kotelnikov Institute of Radio Engineering and Electronics, Russian Academy of Sciences
Email: sva@ulstu.ru
Russian Federation, Ulyanovsk
