Using Variations in the Frequency of a Ring Oscillator to Measure the Thermal Resistance of Digital Integrated Circuits
- Авторлар: Sergeev V.1,2, Teten’kin Y.1
-
Мекемелер:
- Ulyanovsk Branch, Kotelnikov Institute of Radio Engineering and Electronics, Russian Academy of Sciences
- Ulyanovsk State Technical University
- Шығарылым: Том 61, № 2 (2018)
- Беттер: 154-160
- Бөлім: Thermal Measurements
- URL: https://journals.rcsi.science/0543-1972/article/view/246404
- DOI: https://doi.org/10.1007/s11018-018-1402-9
- ID: 246404
Дәйексөз келтіру
Аннотация
We propose using logic-element time delay as a temperature-sensitive parameter to measure the thermal resistance of digital integrated circuits. We show that the frequency of a ring oscillator constructed using logic elements is inversely proportional to the signal delay time and is a linearly decreasing function of the temperature. We describe a technique for measuring the thermal resistance of a digital integrated circuit as it is heated by its own power consumption.
Авторлар туралы
V. Sergeev
Ulyanovsk Branch, Kotelnikov Institute of Radio Engineering and Electronics, Russian Academy of Sciences; Ulyanovsk State Technical University
Хат алмасуға жауапты Автор.
Email: sva@ulstu.ru
Ресей, Ulyanovsk; Ulyanovsk
Ya. Teten’kin
Ulyanovsk Branch, Kotelnikov Institute of Radio Engineering and Electronics, Russian Academy of Sciences
Email: sva@ulstu.ru
Ресей, Ulyanovsk