Modern trends in the application of thermoelectric method in non-destructive testing (review)

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Abstract

The article provides an overview of the main directions of using the thermoelectric testing method in various spheres of the national economy. The thermoelectric method is most widely used in industry. There are publications on the application of the thermoelectric method for quality monitoring of turning and friction stir welding. It is shown that the thermoelectric method makes it possible to increase the reliability of testing and, based on testing data, ensure optimal modes of the technological process of metalworking and welding. A number of articles are devoted to the application of the thermoelectric method to plastic deformation testing, the dependence of thermal EMF on the degree of plastic deformation is revealed. Recently, publications have appeared on the application of the thermoelectric method to testing the thermal resistance of the design “housing of a power semiconductor device-thermal interface-cooling radiator”. This design is very widespread in electronic equipment. In addition, there are articles on the use of the thermoelectric method to testing the transient resistance of contacts in the power supply network. It is shown that with an increase in contact resistance, the value of thermal EMF increases proportionally, which can be used to prevent emergencies in the power supply network. The thermoelectric method has also been successfully applied to diagnose the degree of titanium flooding. The dependence of the thermal EMF value on the degree of hydrogenation has been revealed. The use of the thermoelectric method is not limited to the field of industrial production. The thermoelectric method is successfully used in medicine for the undetectable detection of nucleic acid sequences, for the temperature diagnosis of human teeth, as well as for the diagnosis of inflammatory processes in the human body.

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About the authors

A. I. Soldatov

Tomsk Polytechnic University

Author for correspondence.
Email: asoldafof@tpu.ru
Russian Federation, 634050 Tomsk, Lenin avenue, 30

A. A. Soldatov

Tomsk Polytechnic University

Email: soldatov_aa@tpu.ru
Russian Federation, 634050 Tomsk, Lenin avenue, 30

M. A. Kostina

Tomsk Polytechnic University

Email: kostina_ma@tpu.ru
Russian Federation, 634050 Tomsk, Lenin avenue, 30

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Supplementary files

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2. Fig. 1. Schematic of temperature control by the tool-piece contact pair method [28]

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3. Fig. 2. Variation of thermal EMF during welding [28]

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4. Fig. 3. Stages of friction stir welding with temperature control (red arrows indicate thermoregulator upgrade) [28]

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5. Fig. 4. Electrical circuit of a natural thermocouple cutting tool-workpiece [34]

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6. Fig. 5. Sensor design: 1 - first hot electrode; 2 - heating element; 3 - thermocouples; 4 - second hot electrode

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7. Fig. 6. Thermoelectric control device with differential sensor "THERMOTEST": a - electronics unit; b - differential sensor with a standard and a test sample

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8. Fig. 7. Program interface

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9. Fig. 8. Temperature dependence of the thermal EMF of a hot copper electrode for different degrees of plastic deformation (ε) of a steel wire with a diameter of ≈2.8 mm made of stainless steel X5CrNi1810 [45]

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10. Fig. 9. Dependence of thermal EMF on relative strain (ε) at temperature 40 °C for a wire with diameter ≈2.8 mm from steel X5CrNi1810 [45]

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11. Fig. 10. Dependence of differential thermal EMF on the strain value: solid line - ST3; dashed line - 08KP; dashed line - 12H18N10T

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12. Fig. 11. Schematic representation of the object of study (a) and temperature-time slice of heat distribution in the cylinder (b)

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13. Fig. 12. Dependence of temperature difference on time (a) and thermal paste thickness (b): 1 - specific thermal conductivity of thermal paste 10 times more than nominal; 2 - nominal specific thermal conductivity; 3 - specific thermal conductivity of thermal paste 10 times less than nominal

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14. Fig. 13. Dependence of thermal EMF on the thickness of the thermal interface layer: a - transient mode; b - steady-state mode

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15. Fig. 14. Time dependence of the temperature difference between the power device case and the cooling radiator obtained with the help of thermocouples (a) and with the help of thermal EMF recalculation (b): 1 - without thermal interface; 2 - with partially applied thermal interface (50%); 3 - with applied thermal interface

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16. Fig. 15. Dependence of the thermal EMF on the relative area of the power element housing coverage by the thermal interface

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17. Fig. 16: Temperature dependence of the contact pair on time, at different values of mass at a resistance equal to 0.1 ohm: - 1 g, 0.2 pix. - 2 g, 3 g

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18. Fig. 17. Dynamics of change of thermal EMF at the aluminum-copper contact joint during heating (average value for 10 measurements)

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19. Fig. 18. Dependence of the thermal EMF value on the probe position coordinate: 1 - after hydrogenation after 5 h; 2 - 30 h; 3 - 75 h; 4 - before hydrogenation. The probe temperature is equal to 62°C [61]

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20. Fig. 19. Construction of thermoelectric sensor of temperature and heat flux: 1 - ebonite insulation shell; 2 - copper liquid cooler (15×15×6 mm); 3 - thermoelectric sensor (10×10×2.4 mm); 4 - copper sensor base (0.3 mm); 5 - copper cooler temperature sensor T3; 6, 7 - inlet and outlet pipes (∅ 4 mm); 8 - copper base temperature sensor T2; 9 - layer of heat conducting paste [64]

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