Thermal Conductivity of Low-Alloy Copper for Molds
- Autores: Dubskii G.1, Vdovin K.1, Nefed’ev A.1, Egorova L.1
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Afiliações:
- Magnitogorsk State Technical University
- Edição: Volume 2018, Nº 3 (2018)
- Páginas: 252-258
- Seção: Article
- URL: https://journals.rcsi.science/0036-0295/article/view/172417
- DOI: https://doi.org/10.1134/S0036029518030035
- ID: 172417
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Resumo
A setup is created to determine the main thermotechnical characteristics of copper alloys. At temperatures below 400°C, Cu–Fe alloys are found to have the thermal conductivity and the thermal diffusivity that are lower than those of pure copper by a factor of 1.5–2.0. As the temperature increases, these parameters become close to those of pure copper. The wall of a mold made of a copper alloy with 0.17–0.23 wt % iron has a satisfactory thermal conductivity upon heating to 250–300°C.
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Sobre autores
G. Dubskii
Magnitogorsk State Technical University
Email: kn.vdovin@gmail.com
Rússia, Magnitogorsk
K. Vdovin
Magnitogorsk State Technical University
Autor responsável pela correspondência
Email: kn.vdovin@gmail.com
Rússia, Magnitogorsk
A. Nefed’ev
Magnitogorsk State Technical University
Email: kn.vdovin@gmail.com
Rússia, Magnitogorsk
L. Egorova
Magnitogorsk State Technical University
Email: kn.vdovin@gmail.com
Rússia, Magnitogorsk
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