Thermal Conductivity of Low-Alloy Copper for Molds

Abstract

A setup is created to determine the main thermotechnical characteristics of copper alloys. At temperatures below 400°C, Cu–Fe alloys are found to have the thermal conductivity and the thermal diffusivity that are lower than those of pure copper by a factor of 1.5–2.0. As the temperature increases, these parameters become close to those of pure copper. The wall of a mold made of a copper alloy with 0.17–0.23 wt % iron has a satisfactory thermal conductivity upon heating to 250–300°C.