Effect of 4H-SiC Target Temperature under Ion Irradiation on the Distribution Profile of Al+ Ions


如何引用文章

全文:

开放存取 开放存取
受限制的访问 ##reader.subscriptionAccessGranted##
受限制的访问 订阅存取

详细

4H-SiC was irradiated with Al+ions at an energy of 190 keV. The depth profiles of implanted aluminum were obtained using the secondary ion mass spectrometry method; a comparison was made with profiles calculated in the SRIM program. Using Rutherford backscattering in channeling mode, we studied the amorphization of the crystal structure after ion implantation in the target at room temperature and 400° C. The fluence of 1015 cm−2 was shown to completely disorder the crystal structure under irradiation of a room temperature target. It was found that after ion irradiation of a target heated to 400° C, the penetration depth of the embedded impurity increases. An increase in the target temperature during irradiation leads to the recombination of a significant number of simple defects and the restoration of the crystal structure. The topography of the samples before and after ion irradiation was compared.

作者简介

A. Shemukhin

Skobeltsyn Institute of Nuclear Physics; Center for Quantum Technologies

编辑信件的主要联系方式.
Email: shemuhin@gmail.com
俄罗斯联邦, Moscow, 119191; Moscow

A. Evseev

Skobeltsyn Institute of Nuclear Physics; Faculty of Physics

Email: shemuhin@gmail.com
俄罗斯联邦, Moscow, 119191; Moscow, 119991

A. Kozhemiako

Faculty of Physics

Email: shemuhin@gmail.com
俄罗斯联邦, Moscow, 119991

B. Merzuk

Faculty of Physics

Email: shemuhin@gmail.com
俄罗斯联邦, Moscow, 119991

V. Egorkin

National Research University of Electronic Technology

Email: shemuhin@gmail.com
俄罗斯联邦, Moscow, 124498

Yu. Fedotov

Institute of Solid State Physics

Email: shemuhin@gmail.com
俄罗斯联邦, Moscow, 119991

A. Danilov

Institute of Solid State Physics

Email: shemuhin@gmail.com
俄罗斯联邦, Moscow, 119991

V. Chernysh

Skobeltsyn Institute of Nuclear Physics; Faculty of Physics

Email: shemuhin@gmail.com
俄罗斯联邦, Moscow, 119191; Moscow, 119991

补充文件

附件文件
动作
1. JATS XML

版权所有 © Allerton Press, Inc., 2019