Email this article Electrochemical deposition of Ag–Sn alloys onto copper and titanium plates
- Authors: Mikhailova M.S.1, Roshchin V.M.1, Shilyaeva Y.I.1, Petukhov I.N.1, Fedorov V.A.2
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Affiliations:
- MIET National Research University of Electronic Technology
- Kurnakov Institute of General and Inorganic Chemistry
- Issue: Vol 52, No 12 (2016)
- Pages: 1220-1223
- Section: Article
- URL: https://journals.rcsi.science/0020-1685/article/view/158046
- DOI: https://doi.org/10.1134/S0020168516110091
- ID: 158046
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Abstract
In this paper, we report a detailed study of the thermal properties of a peritectic Ag–Sn alloy electrochemically deposited onto copper and titanium plates in order to produce soldered contact structures. A comparative analysis of Ag and Sn codeposition and layer-by-layer deposition processes is presented.
About the authors
M. S. Mikhailova
MIET National Research University of Electronic Technology
Author for correspondence.
Email: shunya2000@mail.ru
Russian Federation, pl. Shokina 1, Zelenograd, Moscow, 124498
V. M. Roshchin
MIET National Research University of Electronic Technology
Email: shunya2000@mail.ru
Russian Federation, pl. Shokina 1, Zelenograd, Moscow, 124498
Yu. I. Shilyaeva
MIET National Research University of Electronic Technology
Email: shunya2000@mail.ru
Russian Federation, pl. Shokina 1, Zelenograd, Moscow, 124498
I. N. Petukhov
MIET National Research University of Electronic Technology
Email: shunya2000@mail.ru
Russian Federation, pl. Shokina 1, Zelenograd, Moscow, 124498
V. A. Fedorov
Kurnakov Institute of General and Inorganic Chemistry
Email: shunya2000@mail.ru
Russian Federation, Leninskii pr. 31, Moscow, 119991
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