Adhesion in micromechanical systems

Abstract

In this paper adhesion is considered as a factor that to a large extent defines the reliability of technological processes in microelectromechanical systems (MEMS) manufacturing using superficial technology. The physical and chemical conditions of its emergence are investigated, as well as the short-range and superficial forces causing adhesive collapse in MEMS are assessed in quantitative terms. Some suggestions on adhesion prevention at the final stages of the technological process are formulated. The existing and prospective methods used to prevent adhesion in electronic industry are also discussed.