On the rheological behavior of nanoparticles in the force field of the solid surface: Nanotechnological aspects


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The spreading of solid Cu nanoparticles (1–10 nm in diameter) on the (100) Cu surface and solid Au nanoparticles on the (100) Au face is simulated via molecular dynamics. The results for the Cu (nanoparticle)/( 100) Cu system are compared with the available experimental data for Cu microparticles (0.1–10 μm) spreading on the polycrystalline Cu surface. The solid-state spreading phenomenon is found to play an important role in many natural and technological processes. Some potential applications in nanotechnology and restrictions in the operation characteristics of nanosized units and nanomaterials are discussed as well.

作者简介

V. Samsonov

Tver State University

Email: samsonoff@inbox.ru
俄罗斯联邦, ul. Zhelyabova 33, Tver, 170100

A. Bembel

Tver State University

Email: samsonoff@inbox.ru
俄罗斯联邦, ul. Zhelyabova 33, Tver, 170100

T. Samsonov

Tver State University

编辑信件的主要联系方式.
Email: samsonoff@inbox.ru
俄罗斯联邦, ul. Zhelyabova 33, Tver, 170100

I. Popov

Tver State University

Email: samsonoff@inbox.ru
俄罗斯联邦, ul. Zhelyabova 33, Tver, 170100

S. Vasilyev

Tver State University

Email: samsonoff@inbox.ru
俄罗斯联邦, ul. Zhelyabova 33, Tver, 170100

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