Curing of ED-20 Epoxy Resin with Diesterdisulfoanhydride of 2-Hydroxypropyl Saccharin-6-Carboxylic Acid

Abstract

Diesterdisulfoanhydride of 2-hydroxypropyl saccharin-6-carboxylic acid has been obtained by interaction of monoanhydride of sulfoimide of saccharin-6-carboxylyc acid with 1,3-diacetine. The composition and structure of the synthesized compound have been confirmed by the elemental analysis and IR spectroscopy data. The obtained product has been used as a curing agent and a plasticizer for industrial ED-20 epoxy resin. It has been established that diesterdisulfoanhydride of 2-hydroxypropyl saccharin-6-carboxylic acid is an effective curing agent and plasticizer for ED-20 epoxy resin. The composition curing process has been studied by differential thermal analysis using a Paulik-Paulik-Erdey derivatograph. On the basis of the data obtained, it has been revealed that the synthesized diesterdisulfoanhydride combines well with ED-20 epoxy resin but cures it in a severe temperature mode. It has been shown that, by using nadic methyl anhydride as a cocuring agent and an accelerator, the curing temperature range of the composition is shifted to a lower temperature zone. The compositions and structures of initial epoxy resin and cured products have also been determined by elemental analysis and IR spectroscopy.