Pulse Reverse Plating of Silver on Silver Alloy

Abstract

Pulse deposition is a scalable and easy technique to obtain uniform coating without voids. In this work, the electrodeposited silver on silver alloy by pulse–reverse pulse and DC electrodeposition process. The quality of the film was analyzed by various characterization techniques. The structural property was studied by XRD, nitrogen adsorption studies and atomic force microscopy techniques. The electrical and chemical property of the film was analyzed by electrochemical techniques.