Contact Displacement of Copper at Copper Plating of Carbon Steel Parts

Аннотация

The process of the contact displacement of copper by the carbon steel surface in a low-concentrated sulfate electrolyte and in electrolytes containing copper complexes with glycine, tartrate, and ethylenediaminetetraacetate is studied. The method of analyzing the particular reactions of interaction between a steel surface and copper-containing electrolytes in the absence of current is applied. The parameters of the contact exchange kinetics are determined with computer processing of the arrays of the coordinates of the particular polarization dependences of cathodic copper deposition in the electrolytes and the anodic dissolution of steel in the corresponding background solutions, as well as of the chronopotentiograms of steel samples in the electrolytes under study. The values of the contact exchange current density and the relation between the areas of the cathode and anode surface sections are calculated as a function of the steel substrate potential and the steel–electrolyte contact time. The influence of the nickel sublayer thickness on the kinetics of the contact exchange in a low-concentrated sulfate electrolyte is shown.