Improving Spatial Confinement of Anodic Dissolution of Heat-Resistant Chromium−Nickel Alloys during Pulsed Electrochemical Machining
- Авторы: Silkin S.A.1,2, Aksenov E.N.1, Likrizon E.A.1, Petrenko V.I.3, Dikusar A.I.1,3
-
Учреждения:
- Shevchenko Pridnestrovie State University
- Kostroma State University
- Institute of Applied Physics
- Выпуск: Том 55, № 5 (2019)
- Страницы: 493-501
- Раздел: Article
- URL: https://journals.rcsi.science/1068-3755/article/view/231329
- DOI: https://doi.org/10.3103/S1068375519050120
- ID: 231329
Цитировать
Аннотация
Using a microsecond-pulsed current (20 μs) for the high-rate anodic dissolution of heat-resistant chromium−nickel alloys (current density amplitudes up to 100 A/cm2) can enable the improvement of the spatial confinement of anodic dissolution due to the presence of a growing dependence of current efficiency on the current density observed in these conditions. This effect, however, is limited to chromium−nickel steel only, and the duty cycle must be at least 4. We hypothesize that this dependence arises from thermokinetic effects that manifest as a series of interrelated processes with positive feedback: rate of electrochemical reaction (current density)−surface temperature−rate of electrochemical reaction. In certain critical conditions, this relationship results in thermokinetic instability and destruction of passive surface layers.
Об авторах
S. Silkin
Shevchenko Pridnestrovie State University; Kostroma State University
Email: dikusar@phys.asm.md
Молдавия, Tiraspol, 3300; Kostroma, 156005
E. Aksenov
Shevchenko Pridnestrovie State University
Email: dikusar@phys.asm.md
Молдавия, Tiraspol, 3300
E. Likrizon
Shevchenko Pridnestrovie State University
Email: dikusar@phys.asm.md
Молдавия, Tiraspol, 3300
V. Petrenko
Institute of Applied Physics
Email: dikusar@phys.asm.md
Молдавия, Chisinau, MD-2028
A. Dikusar
Shevchenko Pridnestrovie State University; Institute of Applied Physics
Автор, ответственный за переписку.
Email: dikusar@phys.asm.md
Молдавия, Tiraspol, 3300; Chisinau, MD-2028
Дополнительные файлы
