Thermal placement of elements of integrated circuits on crystal surface
- Авторлар: Harutyunyan A.G.1
-
Мекемелер:
- National Polytechnic University of Armenia
- Шығарылым: Том 52, № 3 (2017)
- Беттер: 276-280
- Бөлім: Article
- URL: https://journals.rcsi.science/1068-3372/article/view/228456
- DOI: https://doi.org/10.3103/S1068337217030148
- ID: 228456
Дәйексөз келтіру
Аннотация
The criterion and the corresponding approach for the thermal placement of integrated circuits (IC) elements on the crystal surface are proposed. The criterion of placement is identical to the traditional criteria of minimizing the total length of connections between elements, which at the placement stage enables to apply an additive multiparametric criterion of joint consideration of electrical and thermal modes for operating of the IC elements.
Негізгі сөздер
Авторлар туралы
A. Harutyunyan
National Polytechnic University of Armenia
Хат алмасуға жауапты Автор.
Email: harash@seua.am
Армения, Yerevan
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