Hybrid Technology Combining Vacuum Electrospark Alloying, Cathodic Arc Evaporation, and Magnetron Sputtering for the Deposition of Hard Wear-Resistant Coatings
- Autores: Sheveyko A.N.1, Kuptsov K.A.1, Kiryukhantsev-Korneev P.V.1, Levashov E.A.1, Shtansky D.V.1
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Afiliações:
- National University of Science and Technology “MISiS”
- Edição: Volume 60, Nº 5 (2019)
- Páginas: 598-607
- Seção: Nanostructured Materials and Functional Coatings
- URL: https://journals.rcsi.science/1067-8212/article/view/226892
- DOI: https://doi.org/10.3103/S1067821219050158
- ID: 226892
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Resumo
A novel technology for the deposition of multilayer coatings is proposed. This technology combines electrospark alloying (ESA), pulsed arc evaporation (PAE), and magnetron sputtering (MS) in one vacuum production process. Layers can be deposited using one electrode material at operating pressures from 0.1 Pa to atmospheric pressure. The lower ESA layer provides increased substrate rigidity, perfect adhesion, and a relatively high (up to 100 μm) coating thickness. The upper PAE or MS layer, up to 10 μm in thickness, yields high mechanical and tribological characteristics. The deposition technology of bilayer PAE–ESA and MS–ESA coatings is approved for substrates made of structural and tool steels, titanium alloys using electrodes made of cemented carbides (WC–Co, TiCNiAl), and carbon.
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Sobre autores
A. Sheveyko
National University of Science and Technology “MISiS”
Autor responsável pela correspondência
Email: sheveyko@mail.ru
Rússia, Moscow, 119049
K. Kuptsov
National University of Science and Technology “MISiS”
Autor responsável pela correspondência
Email: koster_koster@mail.ru
Rússia, Moscow, 119049
Ph. Kiryukhantsev-Korneev
National University of Science and Technology “MISiS”
Autor responsável pela correspondência
Email: kiruhancev-korneev@yandex.ru
Rússia, Moscow, 119049
E. Levashov
National University of Science and Technology “MISiS”
Autor responsável pela correspondência
Email: levashov@shs.misis.ru
Rússia, Moscow, 119049
D. Shtansky
National University of Science and Technology “MISiS”
Autor responsável pela correspondência
Email: shtansky@shs.misis.ru
Rússia, Moscow, 119049
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