InAlAs/InGaAs/InP High-Electron-Mobility Transistors with a Composite Channel and Higher Breakdown Characteristics


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Abstract

A high-electron-mobility transistor (HEMT) based on InAlAs/InGaAs/InP heterostructures possessing higher breakdown characteristics is developed. An InGaAs composite channel structure, combined with completely selective forming of the double recess structure, is used in the devices. HEMTs with a T‑shaped gate 120 nm in length consist of four fingers, each 30 μm in width, exhibit a maximum transconductance of  810 mS/mm, 460-mA/mm maximum density of drain current and 8- to 10-V drain-to-gate breackdown voltage. The current-amplification cut-off frequency of transistors is over 115 GHz. Due to the enhanced breakdown voltage and the forming of a double recess structure by selective etching, the elaborated transistors are promising for application in the monolithic integrated circuits of the millimeter-wave medium power amplifiers.

About the authors

N. A. Maleev

Ioffe Institute, Russian Academy of Sciences; St. Petersburg State Electrotechnical University LETI

Author for correspondence.
Email: maleev@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021; St. Petersburg, 197022

A. P. Vasil’ev

Submicron Heterostructures for Microelectronics Research Engineering Center, Russian Academy of Sciences

Email: maleev@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021

A. G. Kuzmenkov

Submicron Heterostructures for Microelectronics Research Engineering Center, Russian Academy of Sciences

Email: maleev@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021

M. A. Bobrov

Ioffe Institute, Russian Academy of Sciences

Email: maleev@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021

M. M. Kulagina

Ioffe Institute, Russian Academy of Sciences

Email: maleev@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021

S. I. Troshkov

Ioffe Institute, Russian Academy of Sciences

Email: maleev@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021

S. N. Maleev

Ioffe Institute, Russian Academy of Sciences

Email: maleev@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021

V. A. Belyakov

JSC “NPP Salyut”

Email: maleev@beam.ioffe.ru
Russian Federation, Nizhny Novgorod, 603107

E. V. Petryakova

JSC “NPP Salyut”

Email: maleev@beam.ioffe.ru
Russian Federation, Nizhny Novgorod, 603107

Yu. P. Kudryashova

JSC “NPP Salyut”

Email: maleev@beam.ioffe.ru
Russian Federation, Nizhny Novgorod, 603107

E. L. Fefelova

JSC “NPP Salyut”

Email: maleev@beam.ioffe.ru
Russian Federation, Nizhny Novgorod, 603107

I. V. Makartsev

JSC “NPP Salyut”

Email: maleev@beam.ioffe.ru
Russian Federation, Nizhny Novgorod, 603107

S. A. Blokhin

Ioffe Institute, Russian Academy of Sciences

Email: maleev@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021

F. A. Ahmedov

NPO TECHNOMASH

Email: maleev@beam.ioffe.ru
Russian Federation, Moscow, 127018

A. V. Egorov

NPO TECHNOMASH

Email: maleev@beam.ioffe.ru
Russian Federation, Moscow, 127018

A. G. Fefelov

JSC “NPP Salyut”

Email: maleev@beam.ioffe.ru
Russian Federation, Nizhny Novgorod, 603107

V. M. Ustinov

Ioffe Institute, Russian Academy of Sciences; St. Petersburg State Electrotechnical University LETI; Submicron Heterostructures for Microelectronics Research Engineering Center, Russian Academy of Sciences

Email: maleev@beam.ioffe.ru
Russian Federation, St. Petersburg, 194021; St. Petersburg, 197022; St. Petersburg, 194021


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