Modeling Deformations in Multichip Packages of NAND Memory
- 作者: Belyaev M.A.1, Putrolaynen V.V.1, Romanenko V.A.2
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隶属关系:
- Petrozavodsk State University
- GS Nanotech
- 期: 卷 44, 编号 10 (2018)
- 页面: 919-922
- 栏目: Article
- URL: https://journals.rcsi.science/1063-7850/article/view/207991
- DOI: https://doi.org/10.1134/S1063785018100176
- ID: 207991
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详细
Deformation of NAND memory multichip packages (MCPs) with various thicknesses of substrate and silicon dies have been numerically simulated. The results of calculations are consistent with experimental data and show equivalence of the deformation in single- and multichip packages with the same total thickness of silicon. Analytical relationship between the values of MCP deformation, substrate core thickness, and total thickness of silicon dies is proposed, which agrees quite well with the data of modeling and can be used for preliminary estimation of MCP deformations.
作者简介
M. Belyaev
Petrozavodsk State University
编辑信件的主要联系方式.
Email: biomax89@yandex.ru
俄罗斯联邦, Petrozavodsk, 185000
V. Putrolaynen
Petrozavodsk State University
Email: biomax89@yandex.ru
俄罗斯联邦, Petrozavodsk, 185000
V. Romanenko
GS Nanotech
Email: biomax89@yandex.ru
俄罗斯联邦, Gusev, Kaliningrad oblast, 238052
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