Deposition of ultrahard Ti–Si–N coatings by pulsed high-current reactive magnetron sputtering


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Abstract

We report on the results of investigation of properties of ultrahard Ti–Si–N coatings deposited by pulsed high-current magnetron reactive sputtering (discharge pulse voltage is 300–900 V, discharge pulse current is up to 200 A, pulse duration is 10–100 μs, and pulse repetition rate is 20–2000 Hz). It is shown that for a short sputtering pulse (25 μs) and a high discharge current (160 A), the films exhibit high hardness (66 GPa), wear resistance, better adhesion, and a lower sliding friction coefficient. The reason is an enhancement of ion bombardment of the growing coating due to higher plasma density in the substrate region (1013 cm–3) and a manifold increase in the degree of ionization of the plasma with increasing peak discharge current (mainly due to the material being sputtered).

About the authors

K. V. Oskomov

Institute of High-Current Electronics, Siberian Branch

Author for correspondence.
Email: oskomov@yandex.ru
Russian Federation, Akademicheskii pr. 2/3, Tomsk, 634055

A. N. Zakharov

Institute of High-Current Electronics, Siberian Branch

Email: oskomov@yandex.ru
Russian Federation, Akademicheskii pr. 2/3, Tomsk, 634055

S. V. Rabotkin

Institute of High-Current Electronics, Siberian Branch

Email: oskomov@yandex.ru
Russian Federation, Akademicheskii pr. 2/3, Tomsk, 634055

A. A. Solov’ev

National Research Tomsk Polytechnic University

Email: oskomov@yandex.ru
Russian Federation, pr. Lenina 30, Tomsk, 634050


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