Laser Micromilling Technology as a Key for Rapid Ceramic MEMS Devices


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The flexible laser micromilling technology for ceramic MEMS production of microhotplates in the surface mount device (SMD) package is described. Current results demonstrate that using described technology makes it possible to manufacture all parts of MEMS sensor in the SMD with form factor of SOT-23 package type.

作者简介

K. Oblov

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

Email: NNSamotaev@mephi.ru
俄罗斯联邦, Moscow, 115409

N. Samotaev

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

编辑信件的主要联系方式.
Email: NNSamotaev@mephi.ru
俄罗斯联邦, Moscow, 115409

M. Etrekova

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

Email: NNSamotaev@mephi.ru
俄罗斯联邦, Moscow, 115409

A. Gorshkova

National Research Nuclear University MEPhI (Moscow Engineering Physics Institute)

Email: NNSamotaev@mephi.ru
俄罗斯联邦, Moscow, 115409

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