Structure of the surface microrelief of a droplet evaporating from a rough substrate as a possible cause of contact angle hysteresis

Abstract

Based on the refraction images of a droplet evaporating on a rough substrate, we simultaneously observed the dynamics of its surface microrelief, contact angle, and contact line deformations along the entire perimeter of the contact line. This has led us conclude that the microrelief structure is directly related to the phenomenon of contact angle hysteresis and the jump-like pattern of contact line deformation. We suggest a possible mechanism for the occurrence of contact angle hysteresis during droplet evaporation and derive the relations that specify the range of possible contact angles at known microrelief parameters.