Fabrication and Wear Performance of (Cu–Sn) Solution/TiCx Bonded Diamond Composites

Abstract

The Cu(Sn)–TiC_x bonded diamond composites were prepared by in situ reaction sintering of Cu, Ti₂SnC and diamond powders. Effect of Ti₂SnC content on the phase composition, microstructure and grinding properties were studied. The result shows that Ti₂SnC was decomposed to TiC_x and Sn. And then, Sn atom dissolved into the crystal lattice of Cu and formed Cu(Sn) solution. The rich C formed at the interface between diamond and the matrix. Excess Ti₂SnC inhibited the formation of Cu solid solution and reacted with Cu to form Cu₃Sn. Additionally, its matrix was mainly composed of TiC_x with better wear resistance, which may improve obviously the grinding performance of the composites. The grinding ratio value of copper–diamond composite was only 132. The grinding ratio value of the composite contained higher Ti₂SnC content in the raw materials was 636.