Defect structure near grain boundaries in deformed polycrystalline Cu–Al alloys

Abstract

The evolution of defect structure upon the deformation of Cu–Al polycrystalline solid solutions with grain sizes of 10, 100, and 200 μm is studied by means of transmission diffraction electron microscopy. Alloys are deformed by tension at a rate of 10⁻² s⁻¹ at room temperature. Different parameters that characterize defect structure are measured. Patterns of changes in them are revealed upon moving away from grain boundaries. Analysis of the results testifies to the presence of a reinforced zone near the grain boundaries.