Local Stress–Strain State of Tribocomposites with Spherical Microcapsules Filled with Liquid Lubricant
- 作者: Kolesnikov V.I.1, Bardushkin V.V.2, Kolesnikov I.V.1, Myasnikov F.V.1, Sychev A.P.1, Yakovlev V.B.2
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隶属关系:
- Rostov State Transport University
- National Research University of Electronic Technology MIET
- 期: 卷 47, 编号 2 (2018)
- 页面: 147-154
- 栏目: Reliability, Strength, and Wear Resistance of Machines and Structures
- URL: https://journals.rcsi.science/1052-6188/article/view/193800
- DOI: https://doi.org/10.3103/S1052618818020061
- ID: 193800
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详细
A method for predicting the local elastic characteristics of multicomponent matrix-assisted tribocomposites with spherical microcapsules filled with a liquid lubricant is proposed. These characteristics are defined by the operators (tensors) of the stress and strain concentration. This method is based on a generalized singular approximation of the theory of random fields and allows taking into consideration the inherent size of microcapsules (the ratio of the shell thickness to the radius of the liquid filler) and the volume fraction of the tribocomposite components. The local elastic characteristics are numerically modelled for the composites based on phenylon with disperse inclusions of alkali-free glass and microcapsules, which are spherical kapton shells filled with glycerin. The dependences of the local elastic properties of the tribocomposites on the inherent size of the microcapsules at fixed volume fractions of the heterogeneity elements are studied.
作者简介
V. Kolesnikov
Rostov State Transport University
Email: alekc_sap@mail.ru
俄罗斯联邦, Rostov-on-Don
V. Bardushkin
National Research University of Electronic Technology MIET
Email: alekc_sap@mail.ru
俄罗斯联邦, Moscow
I. Kolesnikov
Rostov State Transport University
Email: alekc_sap@mail.ru
俄罗斯联邦, Rostov-on-Don
F. Myasnikov
Rostov State Transport University
Email: alekc_sap@mail.ru
俄罗斯联邦, Rostov-on-Don
A. Sychev
Rostov State Transport University
编辑信件的主要联系方式.
Email: alekc_sap@mail.ru
俄罗斯联邦, Rostov-on-Don
V. Yakovlev
National Research University of Electronic Technology MIET
Email: alekc_sap@mail.ru
俄罗斯联邦, Moscow
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