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Study of the ultrafine-grained copper structure formed by dynamic recrystallization by analyzing the etched surface relief
- Authors: Stolbovsky A.V.1, Chikunova N.S.1, Blinov I.V.1
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Affiliations:
- M.N. Mikheev Institute of Metal Physics of the Ural Branch of the Russian Academy of Sciences
- Issue: Vol 89, No 10 (2025)
- Pages: 1665–1670
- Section: Condensed Matter Physics
- URL: https://journals.rcsi.science/0367-6765/article/view/375835
- DOI: https://doi.org/10.7868/S3034646025100197
- ID: 375835
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Abstract
The ultrafine-grained structure of technically pure copper formed by severe plastic deformation has been investigated by methods of structure state estimation including spatial distribution of grain boundary energies. The peculiarities of relaxation processes at the final stage of deformation have been established.
About the authors
A. V. Stolbovsky
M.N. Mikheev Institute of Metal Physics of the Ural Branch of the Russian Academy of SciencesEkaterinburg, Russia
N. S. Chikunova
M.N. Mikheev Institute of Metal Physics of the Ural Branch of the Russian Academy of Sciences
Email: chikunova@imp.uran.ru
Ekaterinburg, Russia
I. V. Blinov
M.N. Mikheev Institute of Metal Physics of the Ural Branch of the Russian Academy of SciencesEkaterinburg, Russia
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