Brittle Fracture of a Material upon Microcutting of the Workpiece Surface by the Microrelief Protrusions of Loose Abrasive Grains

Abstract

The peculiarities of processing of the workpiece surface by a loose polishing material in the areas of small cutting depth not exceeding 1 μm are considered, and mathematical models for the impact of abrasive grain microrelief on processed workpiece surface are presented. It is demonstrated that the fracture of the surface metal layer is more brittle in comparison with microcutting of the workpiece surface by the top of an abrasive grain at a preset force and working parameters of workpiece processing by the surface protrusions of abrasive grains. This intensifies chip formation and promotes the achievement of a given surface quality.