Investigations of g Factors and Local Structures for Cu(en)\(_{3}^{{2 + }}\)Groups in Cu(en)3SO4 and Cu(en)3Cu(CN)3 Polycrystalline Powders


如何引用文章

全文:

开放存取 开放存取
受限制的访问 ##reader.subscriptionAccessGranted##
受限制的访问 订阅存取

详细

From the perturbation formulas for g factors for an orthorhombically compressed octahedral 3d9 group, g factors, and local structures for the [Cu(en)3]2+ groups in Cu(en)3SO4 and Cu(en)3Cu(CN)3 powders are theoretically investigated. The local structure of Cu2+ in Cu(en)3Cu(CN)3 is evaluated by analyzing the experimental g factors and found to exhibit moderate axial compression ΔZ (≈0.018 Å) and planar bond length variation ΔR (≈0.015 Å) related to an ideal octahedron due to the Jahn–Teller effect. The larger experimental axial anisotropy Δg (= (gx + gy)/2 − gz) of Cu(en)3SO4 than Cu(en)3Cu(CN)3 is mainly ascribed to the larger ΔZ (≈0.053 Å) in the former. The calculated g factors for both systems show reasonable agreement with experiment by including the charge transfer (CT) contributions to gz, which have the same sign and much larger magnitude compared to the conventional crystal-field ones and should be included.

作者简介

Xu-Sheng Liu

Department of Applied Physics, School of Physics, University of Electronic Science and Technology of China

编辑信件的主要联系方式.
Email: xsliu999@126.com
中国, Chengdu, 610054

Shao-Yi Wu

Department of Applied Physics, School of Physics, University of Electronic Science and Technology of China

Email: xsliu999@126.com
中国, Chengdu, 610054

Si-Ying Zhong

Department of Applied Physics, School of Physics, University of Electronic Science and Technology of China

Email: xsliu999@126.com
中国, Chengdu, 610054

Li-Juan Zhang

Department of Applied Physics, School of Physics, University of Electronic Science and Technology of China

Email: xsliu999@126.com
中国, Chengdu, 610054

Fu Zhang

Department of Applied Physics, School of Physics, University of Electronic Science and Technology of China

Email: xsliu999@126.com
中国, Chengdu, 610054

补充文件

附件文件
动作
1. JATS XML

版权所有 © Pleiades Publishing, Ltd., 2018