Microstructure and Kinetics of Intermetallic Phase Formation during Solid State Diffusion Bonding in Bimetal Ti/Al
- Авторлар: Amir Hossein Assari 1, Beitallah Eghbali 1
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Мекемелер:
- Department of Materials Science and Engineering, Sahand University of Technology
- Шығарылым: Том 120, № 3 (2019)
- Беттер: 260-268
- Бөлім: Structure, Phase Transformations, and Diffusion
- URL: https://journals.rcsi.science/0031-918X/article/view/168352
- DOI: https://doi.org/10.1134/S0031918X19030025
- ID: 168352
Дәйексөз келтіру
Аннотация
In this study, tri-layered Ti/Al composites were synthesized using hot press/roll bonding, and then the annealing treatment was executed in the temperature range of 550–650°C for 2, 4, and 6 h. Interfacial layers were characterized using scanning electron microscopes (SEM), energy dispersive spectrometer (EDS), and X-ray diffraction (XRD). The results of microstructural characterization for all annealing temperatures and times indicated that the Al3Ti compound is the only intermetallic compound observed in the diffusion layers. The Al3Ti growth obeyed linear kinetics and was characterized by an activation energy of 128.7 kJ mol–1. The results indicated that the dominant diffusing component was aluminum and the growth of the Al3Ti layer occurred mainly at Ti/Al3Ti interfaces.
Негізгі сөздер
Авторлар туралы
Amir Hossein Assari
Department of Materials Science and Engineering, Sahand University of Technology
Email: eghbali@sut.ac.ir
Иран, Tabriz, P.O. Box 51335-1996
Beitallah Eghbali
Department of Materials Science and Engineering, Sahand University of Technology
Хат алмасуға жауапты Автор.
Email: eghbali@sut.ac.ir
Иран, Tabriz, P.O. Box 51335-1996
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