Single-Electron Structures Based on Solitary Dopant Atoms of Arsenic, Phosphorus, Gold, and Potassium in Silicon
- Authors: Presnov D.E.1,2, Dagesyan S.A.1, Bozhev I.V.1, Shorokhov V.V.1, Trifonov A.S.1, Shemukhin A.A.1,2, Sapkov I.V.1, Prokhorova I.G.1, Snigirev O.V.1, Krupenin V.A.1
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Affiliations:
- Quantum Technology Center, Department of Physics
- Skobeltsyn Institute of Nuclear Physics
- Issue: Vol 74, No 2 (2019)
- Pages: 165-170
- Section: Physics of Condensed State of Matter
- URL: https://journals.rcsi.science/0027-1349/article/view/165104
- DOI: https://doi.org/10.3103/S0027134919020164
- ID: 165104
Cite item
Abstract
Here we present CMOS compatible fabrication methods and the results of an experimental study of single-atom single-electron transistors made from silicon on insulator and based on various dopant atoms. Transistors with channels doped with arsenic (As), phosphorus (P), gold (Au) and potassium (K) atoms were fabricated and studied. Two methods for fabricating of experimental transistor structures are presented. The first method (As, P transistors) used a inhomogeneously doped in depth silicon layer and controlled reduction of the size of the transistor channel in several cycles of isotropic reactive-ion etching. The second method (Au and K transistors) used an undoped silicon layer and the subsequent implantation of dopant atoms into a preformed transistor channel. Dopant electron and hole levels of Au and K atoms in silicon are located near the middle of the silicon band gap, which provides a small effective size of the dopant charge center and, as a result, a high value of the charge energy and operating temperature of the transistor compared to the traditional dopants (P, As, Sb, B). The values of the charge energy of the Au and K transistors, which were estimated from the measurements (Ec ≥ 150 meV), are much higher than those of the As and P transistors (Ec < 30 meV). Important advantages of the proposed methods are: controlled implantation of various impurities and possibility to combine etching and implantation cycles during sample preparation.
About the authors
D. E. Presnov
Quantum Technology Center, Department of Physics; Skobeltsyn Institute of Nuclear Physics
Author for correspondence.
Email: denis.presnov@physics.msu.ru
Russian Federation, Moscow, 119991; Moscow, 119991
S. A. Dagesyan
Quantum Technology Center, Department of Physics
Email: krupenin@physics.msu.ru
Russian Federation, Moscow, 119991
I. V. Bozhev
Quantum Technology Center, Department of Physics
Email: krupenin@physics.msu.ru
Russian Federation, Moscow, 119991
V. V. Shorokhov
Quantum Technology Center, Department of Physics
Email: krupenin@physics.msu.ru
Russian Federation, Moscow, 119991
A. S. Trifonov
Quantum Technology Center, Department of Physics
Email: krupenin@physics.msu.ru
Russian Federation, Moscow, 119991
A. A. Shemukhin
Quantum Technology Center, Department of Physics; Skobeltsyn Institute of Nuclear Physics
Email: krupenin@physics.msu.ru
Russian Federation, Moscow, 119991; Moscow, 119991
I. V. Sapkov
Quantum Technology Center, Department of Physics
Email: krupenin@physics.msu.ru
Russian Federation, Moscow, 119991
I. G. Prokhorova
Quantum Technology Center, Department of Physics
Email: krupenin@physics.msu.ru
Russian Federation, Moscow, 119991
O. V. Snigirev
Quantum Technology Center, Department of Physics
Email: krupenin@physics.msu.ru
Russian Federation, Moscow, 119991
V. A. Krupenin
Quantum Technology Center, Department of Physics
Author for correspondence.
Email: krupenin@physics.msu.ru
Russian Federation, Moscow, 119991
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