An apparatus for vacuum deposition of composite TiN−Cu coatings using coupled vacuum-arc and ion-plasma processes
- Authors: Semenov A.P.1, Tsyrenov D.B.1, Semenova I.A.1
- 
							Affiliations: 
							- Institute of Physical Material Science, Siberian Branch
 
- Issue: Vol 60, No 6 (2017)
- Pages: 892-895
- Section: Laboratory Techniques
- URL: https://journals.rcsi.science/0020-4412/article/view/160008
- DOI: https://doi.org/10.1134/S0020441217060094
- ID: 160008
Cite item
Abstract
A plasma-chemical reactor with the coupling of gas-discharge processes has been developed. These processes combine arc evaporation of titanium in a nitrogen-containing plasma and ion-plasma sputtering of copper with the formation of copper vapor. Experiments were carried out on the deposition of superhard nanostructured TiN−Cu composite layers.
About the authors
A. P. Semenov
Institute of Physical Material Science, Siberian Branch
							Author for correspondence.
							Email: semenov@ipms.bscnet.ru
				                					                																			                												                	Russian Federation, 							Ulan-Ude, 670047 Republic of Buryatia						
D. B. -D. Tsyrenov
Institute of Physical Material Science, Siberian Branch
														Email: semenov@ipms.bscnet.ru
				                					                																			                												                	Russian Federation, 							Ulan-Ude, 670047 Republic of Buryatia						
I. A. Semenova
Institute of Physical Material Science, Siberian Branch
														Email: semenov@ipms.bscnet.ru
				                					                																			                												                	Russian Federation, 							Ulan-Ude, 670047 Republic of Buryatia						
Supplementary files
 
				
			 
					 
						 
						 
						 
						 
				 
  
  
  
  
  Email this article
			Email this article  Open Access
		                                Open Access Access granted
						Access granted Subscription Access
		                                		                                        Subscription Access
		                                					