Thermal Expansion and Electrical Resistivity of the Intermetallic Compound Ti 67 Al 33

Zh. Kh. Murlieva; D. K. Palchaev; M. E. Iskhakov; M. Kh. Rabadanov; U. U. Bagomedova

doi:10.1134/S0018151X19020135

Thermal Expansion and Electrical Resistivity of the Intermetallic Compound Ti₆₇Al₃₃

作者: Murlieva Z.K.¹^,2, Palchaev D.K.¹, Iskhakov M.E.¹, Rabadanov M.K.¹, Bagomedova U.U.¹
隶属关系:
1. Dagestan State University
2. Dagestan State University of National Economy
期: 卷 57, 编号 2 (2019)
页面: 182-185
栏目: Thermophysical Properties of Materials
URL: https://journals.rcsi.science/0018-151X/article/view/157936
DOI: https://doi.org/10.1134/S0018151X19020135
ID: 157936

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The thermal expansion coefficient and electrical resistivity are measured simultaneously on the same polycrystalline sample of Ti₆₇Al₃₃ in the temperature range of 300−1000 K. The two measured parameters exhibit a qualitative correlation for both the stable and metastable states of the sample. The temperature dependence of the electrical resistivity is shaped by the competition between the semiconductor and metal conductivity mechanisms.