Effects of Low-Modulus BN Inclusions on Properties of Y-TZP Ceramic
- Авторлар: Buyakov A.S.1,2,3, Mirovoy Y.A.2, Buyakova S.P.1,2,3
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Мекемелер:
- Institute of Strength Physics and Materials Science, Siberian Branch, Russian Academy of Sciences
- School of Advanced Manufacturing Technologies, Tomsk Polytechnic University
- Physical-Technical Faculty, Tomsk State University
- Шығарылым: Том 10, № 5 (2019)
- Беттер: 1159-1163
- Бөлім: General-Purpose Materials
- URL: https://journals.rcsi.science/2075-1133/article/view/208091
- DOI: https://doi.org/10.1134/S2075113319050058
- ID: 208091
Дәйексөз келтіру
Аннотация
We investigate the structure and properties of ceramic based on tetragonal zirconia (Y-TZP) containing low-modulus inclusions of hexagonal boron nitride (h-BN). (Y-TZP)(h-BN) ceramic samples with low h-BN content exhibit increased fracture toughness (K1C). The highest fracture toughness was observed for (Y-TZP)(0.5 wt % h-BN) ceramic: K1C = 12 ± 0.53 MPa m1/2. The increase in failure viscosity caused by incorporation of low-modulus inclusions (i.e., h-BN) is due to two dissipative mechanisms: the martensite transformation of the ZrO2 matrix and crack arrest at relatively weak interfaces between the matrix and low-modulus inclusions of h-BN. As the proportion of h-BN increases, the contribution of martensite transformation to the fracture toughness diminishes, a consequence of the grain size of tetragonal zirconia diminishing, which makes this phase stable.
Негізгі сөздер
Авторлар туралы
A. Buyakov
Institute of Strength Physics and Materials Science, Siberian Branch, Russian Academy of Sciences; School of Advanced Manufacturing Technologies, Tomsk Polytechnic University; Physical-Technical Faculty, Tomsk State University
Хат алмасуға жауапты Автор.
Email: alesbuyakov@gmail.com
Ресей, Tomsk, 634055; Tomsk, 634050; Tomsk, 634050
Yu. Mirovoy
School of Advanced Manufacturing Technologies, Tomsk Polytechnic University
Хат алмасуға жауапты Автор.
Email: y.a.mirovoy@gmail.com
Ресей, Tomsk, 634050
S. Buyakova
Institute of Strength Physics and Materials Science, Siberian Branch, Russian Academy of Sciences; School of Advanced Manufacturing Technologies, Tomsk Polytechnic University; Physical-Technical Faculty, Tomsk State University
Хат алмасуға жауапты Автор.
Email: sbuyakova@ispms.tsc.ru
Ресей, Tomsk, 634055; Tomsk, 634050; Tomsk, 634050
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