The use of PAP-2 aluminum powder to fabricate powder composites: Peculiarities of technology, structure, and physicomechanical properties of composites. Part 2. Study of composite properties and structure
- Autores: Ivanov D.A.1, Sitnikov A.I.1, Ivanov A.V.1, Shlyapin S.D.1
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Afiliações:
- Tsiolkovsky Russian State Technological University (RSTU–MATI)
- Edição: Volume 58, Nº 2 (2017)
- Páginas: 149-160
- Seção: Refractory, Ceramic, and Composite Materials
- URL: https://journals.rcsi.science/1067-8212/article/view/226181
- DOI: https://doi.org/10.3103/S1067821217020055
- ID: 226181
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Resumo
The possibility of reinforcing the Al/Al2O3 laminated cermet matrix with metal rapidly solidified alloy fibers (steel, titanium, and aluminum), as well as discrete duralumin chips, is shown. The maximal reinforcing effect was attained when using titanium and steel fibers with their content of 20 and 10 vol %, respectively, due to the implementation of several energy-intensive destruction mechanisms. Reinforced composites are characterized by the following properties: ρ = 2.30–2.85 g/cm3, σbend = 180–250 MPa, K1c = 7.5–15 MPa m1/2, and KCU = (18–35) × 103 J/m2. The Al/Al2O3–Ccoke.residue has ρ = 2.21–2.23 g/cm3 at a very low sliding friction coefficient of 0.17 (the counterbody is a ball made of steel ShKh-15 under a load of 1 N). The oxide-adhesion bond type, which makes it possible to remove spent grains from the grinding work zone and implement the self-sharpening mode, is formed for the “Al/Al2O3–fused alumina grains” composite. The material that contains kaolin fibers is ultra-light-weight ceramic insulation (0.25–0.5 g/cm3), λ = 0.07–0.2 W/(m K) in the 20–1000°C range. The material including alumina spherulites combines rather high hardness (σbend = 10–50 MPa) and porosity (42–52%) and has increased thermal stability due to the rapid elimination of the temperature gradient on structural elements having a micrometer-size cross section.
Sobre autores
D. Ivanov
Tsiolkovsky Russian State Technological University (RSTU–MATI)
Autor responsável pela correspondência
Email: dali_888@mail.ru
Rússia, Moscow, 121552
A. Sitnikov
Tsiolkovsky Russian State Technological University (RSTU–MATI)
Email: dali_888@mail.ru
Rússia, Moscow, 121552
A. Ivanov
Tsiolkovsky Russian State Technological University (RSTU–MATI)
Email: dali_888@mail.ru
Rússia, Moscow, 121552
S. Shlyapin
Tsiolkovsky Russian State Technological University (RSTU–MATI)
Email: dali_888@mail.ru
Rússia, Moscow, 121552
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