Electrophysical and Physical-Chemical Properties of Ohmic Contacts to III-N Compounds


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Experimental data on studying ohmic contacts based on single-layer and multilayer metallizations on GaN and (In, Al, Ga)N solid solutions are analyzed. The contact resistance of the Ti/Al/Mo/Au and Ti/Al/Mo/W/Au metallizations on undoped GaN is studied. The dependences of the contact resistance on the GaN surface treatment before the metallization and on the metallization annealing regimes are investigated.

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V. Brudnyi

National Research Tomsk State University

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Email: brudnyi@mail.tsu.ru
俄罗斯联邦, Tomsk

M. Vilisova

National Research Tomsk State University

Email: brudnyi@mail.tsu.ru
俄罗斯联邦, Tomsk

L. Velikovskii

National Research Tomsk State University

Email: brudnyi@mail.tsu.ru
俄罗斯联邦, Tomsk

P. Sim

National Research Tomsk State University

Email: brudnyi@mail.tsu.ru
俄罗斯联邦, Tomsk

P. Brudnyi

National Research Tomsk State University

Email: brudnyi@mail.tsu.ru
俄罗斯联邦, Tomsk

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