Electrophysical and Physical-Chemical Properties of Ohmic Contacts to III-N Compounds
- 作者: Brudnyi V.N.1, Vilisova M.D.1, Velikovskii L.É.1, Sim P.Е.1, Brudnyi P.A.1
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隶属关系:
- National Research Tomsk State University
- 期: 卷 61, 编号 8 (2018)
- 页面: 1450-1456
- 栏目: Article
- URL: https://journals.rcsi.science/1064-8887/article/view/240867
- DOI: https://doi.org/10.1007/s11182-018-1555-7
- ID: 240867
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详细
Experimental data on studying ohmic contacts based on single-layer and multilayer metallizations on GaN and (In, Al, Ga)N solid solutions are analyzed. The contact resistance of the Ti/Al/Mo/Au and Ti/Al/Mo/W/Au metallizations on undoped GaN is studied. The dependences of the contact resistance on the GaN surface treatment before the metallization and on the metallization annealing regimes are investigated.
作者简介
V. Brudnyi
National Research Tomsk State University
编辑信件的主要联系方式.
Email: brudnyi@mail.tsu.ru
俄罗斯联邦, Tomsk
M. Vilisova
National Research Tomsk State University
Email: brudnyi@mail.tsu.ru
俄罗斯联邦, Tomsk
L. Velikovskii
National Research Tomsk State University
Email: brudnyi@mail.tsu.ru
俄罗斯联邦, Tomsk
P. Sim
National Research Tomsk State University
Email: brudnyi@mail.tsu.ru
俄罗斯联邦, Tomsk
P. Brudnyi
National Research Tomsk State University
Email: brudnyi@mail.tsu.ru
俄罗斯联邦, Tomsk
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